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Technical Specifications
Package：Tray
Product Status：Obsolete
Architecture：MCU, FPGA
Core Processor：ARM® Cortex®-M3
Flash Size：512KB
RAM Size：64KB
Peripherals：DDR, PCIe, SERDES
Connectivity：CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed：166MHz
Primary Attributes：FPGA - 150K Logic Modules
Operating Temperature：-40°C ~ 100°C (TJ)
Grade：-
Qualification：-
Package / Case：1152-BBGA, FCBGA
Supplier Device Package：1152-FCBGA (35x35)