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Technical Specifications
Series：-
Package：Tray
Product Status：Active
Type：LGA
Number of Positions or Pins (Grid)：250 (16 x 25)
Pitch - Mating：0.039" (1.00mm)
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：3.00µin (0.076µm)
Contact Material - Mating：Copper Alloy
Mounting Type：Surface Mount
Features：Board Guide, Open Frame
Termination：Solder
Pitch - Post：-
Contact Finish - Post：-
Contact Finish Thickness - Post：-
Contact Material - Post：-
Housing Material：Thermoplastic
Operating Temperature：-25°C ~ 100°C