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📦 Stock: 453,013
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Technical Specifications
Package：Bulk
Product Status：Active
Type：PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)：-
Pitch - Mating：0.100" (2.54mm)
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：30.0µin (0.76µm)
Contact Material - Mating：Beryllium Copper
Mounting Type：Through Hole
Features：Closed Frame
Termination：Solder
Pitch - Post：0.100" (2.54mm)
Contact Finish - Post：Tin
Contact Finish Thickness - Post：200.0µin (5.08µm)
Contact Material - Post：Beryllium Copper
Housing Material：Polyphenylene Sulfide (PPS)
Operating Temperature：-65°C ~ 125°C